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Co-authors
- Shanyuan NiuNanjing UniversityVerified email at nju.edu.cn
- R. RAMESHUniversity of California, BerkeleyVerified email at berkeley.edu
- Boyang ZhaoArgonne National LaboratoryVerified email at anl.gov
- Wolter SiemonsASMLVerified email at asml.com
- Huan ZhaoWigner Distinguished Staff Fellow, Oak Ridge National LaboratoryVerified email at ornl.gov
- Mikhail KatsElectrical and Computer Engineering, University of Wisconsin-MadisonVerified email at wisc.edu
- Pim Bram RossenVerified email at berkeley.edu
- Huaixun HuyanHardware development Engineer, Western DigitalVerified email at wdc.com
- Rohan MishraWashington University in St. LouisVerified email at wustl.edu
- Han WangUniversity of Hong KongVerified email at hku.hk
- Yucheng ZhouUniversity of VirginiaVerified email at virginia.edu
- Rehan KapadiaAssociate Professor, University of Southern CaliforniaVerified email at usc.edu
- Mythili SurendranPostdoctoral Scholar, Lawrence Berkeley National LaboratoryVerified email at lbl.gov
- Jiang-Bin WuInstitute of Semiconductors, Chinese Academy of SciencesVerified email at semi.ac.cn
- Jad SalmanUniversity of Wisconsin - MadisonVerified email at wisc.edu
- Patrick E. HopkinsUniversity of VirginiaVerified email at virginia.edu
- Rafael JaramilloAssociate Professor of Materials Science and Enginering, MITVerified email at mit.edu
- Matthew MecklenburgUniversity of California, Los AngelesVerified email at ucla.edu
- Kevin YeMassachusetts Institute of TechnologyVerified email at mit.edu
- Debarghya SarkarResearch Scientist, IBM ResearchVerified email at mgh.harvard.edu