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Jeremy Isaac Martin
Jeremy Isaac Martin
Director of Fuels Policy, Sr. Scientist, Union of Concerned Scientists
Verified email at ucsusa.org - Homepage
Title
Cited by
Cited by
Year
Proper accounting for time increases crop-based biofuels’ greenhouse gas deficit versus petroleum
M O’Hare, RJ Plevin, JI Martin, AD Jones, A Kendall, E Hopson
Environmental Research Letters 4 (2), 024001, 2009
2102009
Mechanical and dielectric properties of pure-silica-zeolite low-k materials
Z Li, MC Johnson, M Sun, ET Ryan, DJ Earl, W Maichen, JI Martin, S Li, ...
ANGEWANDTE CHEMIE-INTERNATIONAL EDITION IN ENGLISH- 45 (38), 6329, 2006
1502006
Polymer brushes: Scaling, compression forces, interbrush penetration, and solvent size effects
JI Martin, ZG Wang
The Journal of Physical Chemistry 99 (9), 2833-2844, 1995
1231995
Examining the equity impacts of autonomous vehicles: a travel demand model approach
J Cohn, R Ezike, J Martin, K Donkor, M Ridgway, M Balding
Transportation research record 2673 (5), 23-35, 2019
562019
NH3/N2-plasma treatment to prevent organic ILD degradation
M Van Ngo, D Hopper, J Martin
US Patent 6,436,808, 2002
562002
Comprehensive reliability evaluation of a 90 nm CMOS technology with Cu/PECVD low-k BEOL
D Edelstein, H Rathore, C Davis, L Clevenger, A Cowley, T Nogami, ...
2004 IEEE International Reliability Physics Symposium. Proceedings, 316-319, 2004
422004
Effects of polymer brush self-assembly on spreading and thin film stability
JI Martin, ZG Wang, M Schick
Langmuir 12 (20), 4950-4959, 1996
391996
Dielectric formation to seal porosity of low dielectic constant (low k) materials after etch
P Besser, S Dakshina-Murthy, J Martin, J Smith, E Apelgren
US Patent App. 09/487,531, 2001
362001
Effect of material properties on integration damage in organosilicate glass films
ET Ryan, J Martin, K Junker, J Wetzel, DW Gidley, J Sun
Journal of Materials Research 16, 3335-3338, 2001
312001
Reliability, yield, and performance of a 90 nm SOI/Cu/SiCOH technology
D Edelstein, C Davis, L Clevenger, M Yoon, A Cowley, T Nogami, ...
Proceedings of the IEEE 2004 International Interconnect Technology …, 2004
262004
Perspective: Don't foul the water
J Martin
Nature 474 (7352), S17-S17, 2011
252011
Integration of SiCN as a low/spl kappa/etch stop and Cu passivation in a high performance Cu/low/spl kappa/interconnect
J Martin, S Filipiak, T Stephens, F Huang, M Aminpur, J Mueller, ...
Proceedings of the IEEE 2002 International Interconnect Technology …, 2002
252002
Copper damascene with low-k capping layer and improved electromigration reliability
M Van Ngo, JI Martin, H Ruelke
US Patent 6,797,652, 2004
242004
Resist trim process to define small openings in dielectric layers
S Dakshina-Murthy, PR Besser, JB Smith, EM Apelgren, C Zistl, JI Martin, ...
US Patent 6,500,755, 2002
23*2002
Semiconductor component and method of manufacture
KS Sahota, J Martin, RJ Huang, JJ Xie
US Patent 6,927,113, 2005
192005
Locally increasing sidewall density by ion implantation
EM Apelgren, C Zistl, JI Martin, PR Besser, F Cheung
US Patent 6,610,594, 2003
192003
Method and test structure for characterizing sidewall damage in a semiconductor device
JI Martin, NJ Kepler, LL Zhao
US Patent 6,600,333, 2003
182003
Graded oxide caps on low dielectric constant (low K) chemical vapor deposition (CVD) films
JI Martin, TY Tsui
US Patent 6,498,112, 2002
182002
Polymer‐tethered ligand–receptor interactions between surfaces
JI Martin, CZ Zhang, ZG Wang
Journal of Polymer Science Part B: Polymer Physics 44 (18), 2621-2637, 2006
172006
Competition between direct and concerted movements in surface diffusion with application to the Au (110) surface
LD Roelofs, JI Martin, R Sheth
Surface science 250 (1-3), 17-26, 1991
171991
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