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Co-authors
David J. SrolovitzDept of Mechanical Eng., The University of Hong KongVerified email at hku.hk
Te-Huan LiuMassachusetts Institute of TechnologyVerified email at mit.edu
Cheng-Kuang LeeIndustrial Technology Research Institute; Max Planck Institute; UC Berkeley; Academia SinicaVerified email at itri.org.tw
Stephen FoilesSandia National LaboratoriesVerified email at sandia.gov
Jerrold A. FloroUniversity of Virginia, Department of Materials Science and EngineeringVerified email at virginia.edu
Zhen-Yu JuangSulferScience Technology Co., Ltd.Verified email at sulfurscience.com
Lain-Jong LiUniversity of Hong KongVerified email at hku.hk
Hao-Wu LinNational Tsing Hua UniversityVerified email at mx.nthu.edu.tw
Baskar GanapathysubramanianNSF/USDA AI Institute, Iowa State UniversityVerified email at iastate.edu
Olga WodoUniversity at Buffalo, Materials Design and Innovation DepartmentVerified email at buffalo.edu
Dr. Wen-Jay LeeNational center for high performance computingVerified email at nchc.narl.org.tw
Sriram SwaminarayanLos Alamos National laboratoryVerified email at lanl.gov
Shao-Sian Li (李紹先)Department of Materials and Mineral Resources, National Taipei University of TechnologyVerified email at mail.ntut.edu.tw
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