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Jonathan D. PosnerProfessor of Mechanical Engineering & Chemical Engineering, University of WashingtonVerified email at uw.edu
Cullen BuieProfessor, MITVerified email at mit.edu
Wei Wang (王威)Harbin Institute of Technology (Shenzhen)Verified email at hit.edu.cn
Zhifei GeMechanical Engineering, MITVerified email at mit.edu
Paulo A. Garcia, Ph.D.Research Scientist, Massachusetts Institute of TechnologyVerified email at vt.edu
Shi-Fang Duan (Shifang Duan )Harbin Institute of Technology (Shenzhen)Verified email at stu.hit.edu.cn
Wai Hong Ronald ChanInstitute of High Performance Computing (IHPC), Agency for Science, Technology & Research (A*STAR)Verified email at ihpc.a-star.edu.sg
Bruno FigliuzziMines ParisVerified email at minesparis.psl.eu
Shrishti SinghInnovation Fellow, University of MichiganVerified email at umich.edu
Naga Neehar DingariTCS ResearchVerified email at tcs.com
Michael S StranoMITVerified email at mit.edu
Chao ZHOUInstitute of Plasma Physics, CASVerified email at utwente.nl
David M. WarsingerPurdue University, Yale University, Massachusetts Institute of TechnologyVerified email at purdue.edu
Yuhang FangPurdue University;Verified email at purdue.edu
Amit Kumar Singh, Ph.D.Assistant Professor, Woxsen UniversityVerified email at iitg.ac.in
Yixin PengHarbin Institute of Technology(ShenZhen)Verified email at stu.hit.edu.cn
Remi VenezianoAssociate Professor, Department of Bioengineering, George Mason UniversityVerified email at gmu.edu
Leandro G. Soto CordovaPhD Student, Johns Hopkins UniversityVerified email at jhu.edu
Parag V. ChitnisDepartment of Bioengineering, George Mason UniversityVerified email at gmu.edu
Zhe YuanEli Lilly and CompanyVerified email at lilly.com