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- Greg P. CarmanUCLAVerified email at seas.ucla.edu
- Kang L. WangElectrical Engineering DepartmentVerified email at ee.ucla.edu
- Tien-Kan "TK" Chung1st: Mechanical Eng. Dept., 2nd: College of Semiconductor Tech., National Chiao Tung UniversityVerified email at nctu.edu.tw
- Christopher S. LynchDean of Engineering, UCRVerified email at engr.ucr.edu
- Ping ZhaoUniversity of MinnesotaVerified email at d.umn.edu
- Mingqiang BaoUniversity of CaliforniaVerified email at skyworksinc.com
- Matteo RinaldiDirector, Institute for NanoSystems Innovation at Northeastern UniversityVerified email at ece.neu.edu
- Pedram KhaliliProfessor, Northwestern UniversityVerified email at northwestern.edu
- Songbin GongAssociate Professor of ECE, Univ of Illinois at Urbana ChampaignVerified email at illinois.edu
- Ruochen LuAssistant Professor, University of Texas at AustinVerified email at utexas.edu
- Chin-Jui HsuUniversity of California, Los AngelesVerified email at ucla.edu
- Peter WarnickeSwiss Light Source, PSI, SwitzerlandVerified email at psi.ch
- Zhenyun QianAssociate Research Professor, Northeastern UniversityVerified email at northeastern.edu
- Alexander KhitunUniversity of California RiversideVerified email at engr.ucr.edu
- Sergiy CherepovHGST a Western Digital company, San Jose, CAVerified email at hgst.com
- Juan G AlzateApple/Intel/UCLA/UniAndesVerified email at apple.com
- Olav SolgaardProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Stephen HamannPhD, Dept. of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Roger T HoweStanford UniversityVerified email at stanford.edu
- Scott KellerVerified email at g.ucla.edu