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Co-authors
- richard randcornell universityVerified email at cornell.edu
- Jon Juel ThomsenTechnical University of DenmarkVerified email at mek.dtu.dk
- Dmitri TcherniakSenior research engineer, Hottinger Bruel & Kjaer, HBKVerified email at bksv.com
- Marie BrønsAssistant Professor, Technical University of DenmarkVerified email at dtu.dk
- Brian P MannProfessor of Mechanical Engineering and Material Science, Duke UniversityVerified email at duke.edu
- David B. HavilandKTH The Royal Institute of TechnologyVerified email at kth.se
- Riccardo BorganiIntermodulation ProductsVerified email at intermod.pro
- Daniel ForchheimerIntermodulation Products ABVerified email at intermodulation-products.com
- Isabelle SchneiderFreie Universität BerlinVerified email at fu-berlin.de
- Geoffrey Recktenwald, Ph.D.Faculty, Michigan State UniversityVerified email at msu.edu
- Per-Anders ThorénNanostructure Physics, Royal Institute of Technology (KTH)Verified email at kth.se
- Illia DobrydenRoyal University of Technology (KTH), SwedenVerified email at kth.se
- Mohamed Belhaquniversity Hassan II-Casablanca