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Co-authors
- Minkyu JeAssociate Professor, School of Electrical Engineering, KAISTVerified email at kaist.ac.kr
- Inkyu ParkProfessor of Mechanical Engineering, KAISTVerified email at kaist.ac.kr
- Hyung-Joun YooDept. Electrical Engineering, KAISTVerified email at kaist.ac.kr
- Soon-Jae KweonAssistant Professor, School of Information, Communications and EE, The Catholic University of KoreaVerified email at catholic.ac.kr
- Sohmyung HaAssociate Professor, New York University Abu DhabiVerified email at nyu.edu
- Hyungjoo ChoKAIST EEVerified email at kaist.ac.kr
- Yongrok JeongKorea Atomic Energy Research Institute (KAERI)Verified email at kaeri.re.kr
- Incheol ChoKorea Advanced Institute of Science and Technology (KAIST)Verified email at kaist.ac.kr
- Jeong-ho ParkSamsung ElectronicsVerified email at kaist.ac.kr
- Sein OhKAISTVerified email at kaist.ac.kr
- Kyuyoung KimVPIX MEDICAL, Inc.Verified email at vpixmedical.com
- Jaeho ParkStanford UniversityVerified email at stanford.edu
- Song-I CheonPh.D student, School of Electrical Engineering, KAISTVerified email at kaist.ac.kr
- Yoontae JungimecVerified email at imec.be
- Yeseul JeonQualcomm IncVerified email at qti.qualcomm.com
- Gichan YunKAISTVerified email at kaist.ac.kr
- Morteza AmjadiAssociate Professor of Biomedical Engineering, University of GlasgowVerified email at glasgow.ac.uk
- Chisung BaeSamsung Advanced Institute of technologyVerified email at samsung.com
- Hyuntak JeonPh.D. Student, School of Electrical Engineering, KAISTVerified email at kaist.ac.kr
- Chul KimAssociate Professor, KAISTVerified email at kaist.ac.kr